DesignCon 2018 Panel
USR Alliance: The MCM is the New PCB Panelists: Brian Holden | VP of Standards, Kandou Bus SA Yaniv Kopelman | CTO, Networking, Marvell Semiconductor, Inc. David Stauffer | Principal Engineer, Kandou Bus SA Gidi Navon | Principal Engineer, Marvell Semiconductor, Inc. Location: Ballroom G Date: Tuesday, January 30 Time: 4:45pm - 6:00pm Pass Types: 2-Day Pass, All Access Pass, Alumni All Access Pass, Boot Camp Pass, Expo Pass - Get your pass now! Track: 01. Signal & Power Integ
The USR-Alliance – Enabling an Open Multi-Chip Module (MCM) Ecosystem
The semiconductor industry is witnessing exponential growth and rapid changes to its bandwidth requirements, as well as increasing design co
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