NEWS & EVENTS
HOW TO JOIN
November 9, 2017
USR Alliance: The MCM is the New PCB
Brian Holden | VP of Standards, Kandou Bus SA
Yaniv Kopelman | CTO, Networking, Marvell Semiconductor, Inc.
David Stauffer | Principal Engineer, Kandou Bus SA
Gidi Navon | Principal Engineer, Marvell Semiconductor, Inc.
November 8, 2017
Gidi Navon, System Architect, Marvell
The semiconductor industry is witnessing exponential growth and rapid changes to its bandwidth requirements, as well as increasing design complexity, emergence
DesignCon 2018 Panel
The USR-Alliance – Enabling an Open Multi-Chip Module (MCM) Ecosystem
November 2017 (2)