DesignCon 2018 Panel
USR Alliance: The MCM is the New PCB Panelists: Brian Holden | VP of Standards, Kandou Bus SA Yaniv Kopelman | CTO, Networking, Marvell...
The USR-Alliance – Enabling an Open Multi-Chip Module (MCM) Ecosystem
The semiconductor industry is witnessing exponential growth and rapid changes to its bandwidth requirements, as well as increasing design co