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DesignCon 2018 Panel

USR Alliance: The MCM is the New PCB


Brian Holden | VP of Standards, Kandou Bus SA

Yaniv Kopelman | CTO, Networking, Marvell Semiconductor, Inc.

David Stauffer | Principal Engineer, Kandou Bus SA

Gidi Navon | Principal Engineer, Marvell Semiconductor, Inc.

Location: Ballroom G

Date: Tuesday, January 30

Time: 4:45pm - 6:00pm

Pass Types: 2-Day Pass, All Access Pass, Alumni All Access Pass, Boot Camp Pass, Expo Pass - Get your pass now!

Track: 01. Signal & Power Integrity at the Single-Multi Die, Interposer, and Packaging Level

Audience Level: All

Format: 75-Minute Panel Discussion

A panel of contributors from a new industry consortium, the USR Alliance will discuss the challenges of connecting semiconductor dies on large MCMs (Multi-Chip Modules), which have become the new printed circuit boards as bandwidth and power dissipation has escalated. The presenters will discuss the MCM-focused technical specifications that are being worked on at the Alliance and will also talk about their company's viewpoints about the reaches, modulation techniques, and measurement techniques needed to create a multi-vendor ecosystem of devices for MCMs.


Audience members will learn about the technical challenges of System in Package and Multi-Chip-Module devices that have led to launch of a new standards development organization, the USR Alliance, which is focused on developing interoperability specifications to enable these emerging ecosystems.

Intended Audience

Audience members may benefit from having some familiarity with high-speed interconnect and multi-chip modules.

For more information on the DesignCon 2018 panels, please visit the DesignCon event page.

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