The USR-Alliance – Enabling an Open Multi-Chip Module (MCM) Ecosystem

The semiconductor industry is witnessing exponential growth and rapid changes to its bandwidth requirements, as well as increasing design complexity, emergence of new processes and integration of multi-disciplinary technologies. All this is happening against a backdrop of shorter development cycles and fierce competition. Other technology-driven industry sectors, such as software and hardware, are addressing similar challenges by creating open alliances and open standards. This blog does not attempt to list all the open alliances that now exist — the Open Compute Project, Open Data Path and the Linux Foundation are just a few of the most prominent examples. One technological area that still hasn’t embraced such open collaboration is Multi-Chip-Module (MCM), where multiple semiconductor dies are packaged together, thereby creating a combined system in a single package. To read more, click here.


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