A New MCM Ecosystem
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As chip bandwidths have exponentially grown, the die areas of those chips have grown to the point where yields have dropped.  This has led to a trend of sub-dividing large semiconductor devices and mounting them on Multi-Chip Module (MCM).  As a result, the MCM has become the new printed circuit board (PCB). 

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What is needed is an ecosystem of interoperable components, interconnects, protocols and software to help implementers create value.  The USR Alliance was established to provide a standards development organization focused on the needs of this market.

What is USR?
  • Ultra Short Reach Link – An efficient & low power interconnect within a Multi-Chip Module (MCM) and other low-loss interconnects
     

    • Typically 2.5 cm or shorter

    • Ideally can tolerate routing bends in order to reach the corner of the MCM

    • Low power and high bandwidth interconnect
What technologies are needed in USR Applications
  • Hardware Protocols – digital to digital communication layers, Protocol Convergence Sublayer (PCS), and Forward Error Correction (FEC) blocks

  • Firmware – device discovery, capability management, configuration, and retraining firmware for example

  • Software – application suites that leverage the capabilities of the chipset components

Who can use USR links?
  • Switch fabric to I/O subsystem

  • Packet processor to I/O subsystem

© 2017 by ​USR Alliance.